Advanced Thermal Solutions (ATS) launched a new family of ultra-high performance heat sinks designed for cooling high powered CPUs, GPUs, FPGAs, and AI processors.
ATS revealed its new family includes active heat sinks with integral blowers and passive heat sinks that use available airflow to provide thermal management. According to the test data, the active heat sinks provide a 20% improvement in cooling. The new active heat sinks, dualFLOW and quadFLOW are designed to be used on moderate to high component density PCBs, including 1U and 2U boards. As the name implies, dualFLOW heat sinks draw air from two opposite directions, and quadFLOW sinks pull air from all four linear sides. Thus, the fast-moving, high volume air helps maximize thermal performance.
The passive (fanless) cooling solutions in ATS’ new ultra-cool family are straight-fin heat sinks. They come in blue anodized aluminum or nickel-plated copper depends on thermal performance and weight requirements. These solutions are ideal for the systems with open airflow from front to back.
ATS’ new ultra-cool sinks fit standard Intel LGA 2011 sockets (Socket R) square and LGA 2066 sockets (Socket R4) commonly used in high-end cloud and edge server applications. There is also an optional backing plate is available for applications other than the Intel LGA 2011 socket. These backing plates attach beneath the PCB to avoid damaging the board when attaching the cooler. The heat sinks are rated to handle a maximum Thermal Design Power of up to 190 Watts.