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Home > Hardware > Advanced Thermal Solutions launched high-performance heat sinks

Advanced Thermal Solutions launched high-performance heat sinks


Erdem Yasar Erdem Yasar
November 22, 2019
1 min read
Advanced Thermal Solutions launched high-performance heat sinks

Advanced Thermal Solutions (ATS) launched a new family of ultra-high performance heat sinks designed for cooling high powered CPUs, GPUs, FPGAs, and AI processors.

ATS revealed its new family includes active heat sinks with integral blowers and passive heat sinks that use available airflow to provide thermal management. According to the test data, the active heat sinks provide a 20% improvement in cooling. The new active heat sinks, dualFLOW and quadFLOW are designed to be used on moderate to high component density PCBs, including 1U and 2U boards. As the name implies, dualFLOW heat sinks draw air from two opposite directions, and quadFLOW sinks pull air from all four linear sides. Thus, the fast-moving, high volume air helps maximize thermal performance.

Passive cooling

The passive (fanless) cooling solutions in ATS’ new ultra-cool family are straight-fin heat sinks. They come in blue anodized aluminum or nickel-plated copper depends on thermal performance and weight requirements. These solutions are ideal for the systems with open airflow from front to back.

ATS’ new ultra-cool sinks fit standard Intel LGA 2011 sockets (Socket R) square and LGA 2066 sockets (Socket R4) commonly used in high-end cloud and edge server applications. There is also an optional backing plate is available for applications other than the Intel LGA 2011 socket. These backing plates attach beneath the PCB to avoid damaging the board when attaching the cooler. The heat sinks are rated to handle a maximum Thermal Design Power of up to 190 Watts.

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Tags: Advanced Thermal Solutions
Erdem Yasar

Erdem Yasar

Erdem Yasar is a news editor at Cloud7 News. Erdem started his career by writing video game reviews in 2007 for PC World magazine while he was studying computer engineering. In the following years, he focused on software development with various programming languages. After his graduation, he continued to work as an editor for several major tech-related websites and magazines. During the 2010s, Erdem Yasar shifted his focus to cloud computing, hosting, and data centers as they were becoming more popular topics in the tech industry. Erdem Yasar also worked with various industry-leading tech companies as a content creator by writing blog posts and other articles. Prior to his role at Cloud7 News, Erdem was the managing editor of T3 Magazine.

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