Wiwynn launched its standalone rack-level liquid cooling solution for Open Compute Project (OCP) server setups. Wiwynn’s advanced liquid cooling solution supports up to 36kW per rack and enables high power component usage at the L10 level. The system cools the liquid which transferred the heat of high-power components (CPU, GPU or ASIC) from cold plates by utilizing the rear door heat exchanger (RDHx).
OCP cooling solutions
The rack-level cooling solution design creates a standalone system without the need for extra facility coolant and infrastructure changes. Additionally, it will support the Open Compute Project (OCP) Open Rack Standard V3 (ORV3) spec. This high-efficiency cooling system can be used by existing and future OCP systems.
Sunlai Chang, Senior Vice President and CTO of Wiwynn, said,
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“We have witnessed the power consumption of data center IT systems surging year over year for the flourish of cloud and AI applications. We are proud to introduce our innovative standalone rack level liquid cooling solution. It assists data centers to face the challenge of increasing power density while requiring no infrastructure changes as well as providing enhanced serviceability and management.”